Multichip modules (MCMs) are a type of electronic packaging technology that allows for the integration of multiple semiconductor chips into a single module. This technology has become increasingly popular in recent years due to the demand for smaller, more powerful electronic devices. MCMs offer several advantages over traditional single-chip packaging, including improved performance, reduced size and weight, and increased functionality. MCMs typically consist of multiple chips mounted on a single substrate, which is then encapsulated in a protective package. The chips are interconnected using a variety of techniques, such as wire bonding, flip-chip bonding, or soldering. The substrate itself can be made from a variety of materials, including ceramics, glass, or organic materials such as FR-4. One of the key advantages of MCMs is their ability to integrate multiple functions into a single package. For example, a typical MCM might include a microprocessor, memory, and other support chips, all mounted on a single substrate. This integration can lead to significant improvements in performance, as the shorter interconnects between chips result in faster signal propagation times. Another advantage of MCMs is their ability to reduce the overall size and weight of electronic devices. By integrating multiple chips into a single module, the need for separate packages and interconnects is eliminated, resulting in a smaller and lighter device. This is particularly important in applications where size and weight are critical, such as mobile devices or aerospace applications. In conclusion, multichip modules are a powerful packaging technology that allows for the integration of multiple semiconductor chips into a single module. They offer several advantages over traditional single-chip packaging, including improved performance, reduced size and weight, and increased functionality. As the demand for smaller, more powerful electronic devices continues to grow, MCMs are likely to become even more important in the years ahead.
electronic packaging, semiconductor chips, substrate, interconnects, performance
CITATION : "Nicholas Smith. 'Multichip Modules.' Design+Encyclopedia. https://design-encyclopedia.com/?E=374697 (Accessed on July 16, 2025)"
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