Design Of Multichip Modules

Design Of Multichip Modules

Multichip modules (MCMs) are a type of electronic packaging technology that combines multiple integrated circuit dies within a single device. MCMs offer significant advantages over traditional monolithic integrated circuits in terms of increased functionality, higher speed, and reduced size and weight. Designing MCMs requires careful consideration of various factors. A good MCM design should have the following characteristics: 1. Integration: MCMs should integrate a variety of components onto a single substrate, including logic cores, memory, power, and passive components. 2. Interconnectivity: Adequate interconnectivity should be established between the integrated circuits, with low resistance and inductance, to ensure high-speed operation and minimal signal loss. 3. Thermal Management: Thermal management is a critical factor in MCMs, which may contain several heat generating components in a confined space, and a good design should employ efficient thermal management techniques, such as microchannels or heat sinks. 4. Testing: MCMs should be easy and efficient to test, especially the interconnects between the components to ensure reliability. 5. Manufacturability: MCMs should be easy to manufacture, with minimized defects, from component addition to alignment. In summary, MCMs provide significant advantages in terms of performance, size, and weight, and their design relies on careful consideration of different factors, such as integration, interconnectivity, thermal management, testing, and manufacturability.

Multichip modules, electronic packaging technology, integration, interconnectivity, thermal management, testing, manufacturability

— Jason Scott

CITATION : "Jason Scott. 'Design Of Multichip Modules.' Design+Encyclopedia. https://design-encyclopedia.com/?E=285867 (Accessed on August 02, 2025)"