Thick Film Hybrid Integrated Circuits

Thick Film Hybrid Integrated Circuits

Thick film hybrid integrated circuits (HICs) are a type of electronic circuit that combines both thick film and thin film technologies. They are commonly used in applications that require high reliability and performance, such as in military and aerospace systems, medical devices, and industrial control systems. Thick film HICs are created by depositing a layer of conductive paste onto a ceramic substrate. The paste is then fired at a high temperature to create a thick, durable layer of conductive material. This layer is then patterned using photolithography or other techniques to create the desired circuit layout. Thin film technology is then used to add additional layers to the circuit. These layers are typically made of materials such as silicon, silicon dioxide, and aluminum, and are deposited using techniques such as sputtering or chemical vapor deposition. The thin film layers are then patterned using similar techniques to create the final circuit. One of the key advantages of thick film HICs is their ability to handle high power levels. The thick film layer provides excellent thermal conductivity, allowing the circuit to dissipate heat more effectively. This makes thick film HICs ideal for applications that require high power handling, such as in power supplies and motor control circuits. Another advantage of thick film HICs is their high reliability. The thick film layer provides excellent resistance to mechanical stress and thermal shock, making these circuits ideal for use in harsh environments. Additionally, the use of ceramic substrates provides excellent resistance to moisture and other environmental factors, further enhancing the reliability of these circuits. Overall, thick film HICs are a versatile and reliable technology that is well-suited for a wide range of applications. Their ability to handle high power levels and harsh environments makes them ideal for use in critical systems where reliability is paramount.

thick film, hybrid integrated circuits, high power handling, reliability, ceramic substrate

— John Lewis